Precision machining is evolving from micron level to nanometer level, and ultra-precision machining has achieved 10 nanometer dimensional accuracy and 1 nanometer surface roughness. Composite technologies such as semi-fixed abrasive machining, combined with mechanical grinding and chemical action, achieve high-precision flatness in integrated circuit substrate processing. In the future, the focus will be on developing technologies such as multi-energy field composite machining and intelligent process control systems to meet the precision requirements of micro-mechanical manufacturing and optical components.
